| zhongkof99 |
2007-03-15 09:23 |
高亮度LED封裝工藝及方案
摘 要 Er1u1@
>1 I2R/'
隨著手機閃光燈、大中尺寸（NB、LCD-TV等）顯示屏光源模塊以至特殊用途照明系統(tǒng)之應用逐漸增多。末來再擴展至用于一般照明系統(tǒng)設備，采用白光LED技術之大功率（High Power）LED市場將陸續(xù)顯現。在技術方面，現時遇到最大挑戰(zhàn)是提升及保持亮度，若再增強其散熱能力，市場之發(fā)展深具潛力。 w?W e|x3
(H %d]
With the increasing application of mobile flashlight, large and medium sizes displays (NB, LCD-TV), illumination system in special usage and other future development in illumination devices, high power LED with white light LED in entering the market in succession. The biggest challenge present is how to raise and keep the brightness. If the capability of heat radiating can be boosted up, the technology will have more powerful market potential. k|Yv8+XT
z
| |